Since the company’s foundation in 1894, OGURA has been engaged in processing industry jewels. Jewel materials like diamond, sapphire/ruby are able to form a sharp edge as characteristic of single crystal.
By utilizing the property, OGURA has been providing products to meet current needs by keeping on brushing up micro precision technology.
Our strong technology of micro and precision perforation and processing tip-ends is able to make a sharp and higher precise shape.
Perforation
Feature of perforation
- Inner diameter precision
Hole diameter: ±1µm and more. - Precision of hole:
circularity: 1µm and more.
- Size of Hole diameter:
φ30µm at minimum and more.
- Precision of polishing inner surface of hole:
Ra0.2µm and less. - Processing smooth inner surface to be used for guides and liquid nozzles.
[Ruby] Perforation data
Ruby
Material:Single crystal ruby
Polishing a hole of micro diameter with high roundness.
[Perforating ruby]
Hole diameterφ41.5µm
Circularity 0.3µm
Image of perforation
Cross section of perforating diamond
Cross section of perforating sapphire
Cross section of perforating tungsten
carbide
Cross section of perforating ceramics
Processing tip-end
Features of processing tip-end
- Precision of tip-end R shape:
P-V=0.2µm and more - Precision of tip-end size: SR±1µm and more
- Tip-end R size: 1µm and less
- Polishing tip-end
Data of processing tip-end
Diamond
Materials: Single crystal diamond
Micro R shape
High precision of R shape
[Polishing diamond]
Tip-end R2.02µm
Image of machining tip-end
Diamond:Tip-end processing
Diamond:Quadrangular pyramid
processing
Tungsten carbide:Tip-end processing
Diamond:Trigonal pyramid processing
Processing surface
Features of processing surface
- Roughness of processing surface
Polishing Ra0.001µm and more (Reference: Depending of materials) - Roughness of processing surface of cylinder
Ra0.01µm and more (Reference: Depending on materials)
Data of processing surface
Sapphire
Processing to sufficient roughness level for a window of sensor.
[Processing flat surface]
Surface roughness Ra0.0064µm
Image of processing surface
Diamond:Polishing flat surface
Ceramics:Polishing flat surface
Sapphire:Polishing cylinder
Tungsten carbide:Polishing tapered
surface